Formation of Au-Silane Bonds

Joint Authors

Kalcheim, Yoav
Paltiel, Yossi
Katzir, Eran
Millo, Oded
Yochelis, Shira
Gutkin, Vitaly

Source

Journal of Nanotechnology

Issue

Vol. 2012, Issue 2012 (31 Dec. 2012), pp.1-8, 8 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2012-06-27

Country of Publication

Egypt

No. of Pages

8

Main Subjects

Engineering Sciences and Information Technology
Chemistry

Abstract EN

Many intriguing aspects of molecular electronics are attributed to organic-inorganic interactions, yet charge transfer through such junctions still requires fundamental study.

Recently, there is a growing interest in anchoring groups, which considered dominating the charge transport.

With this respect, we choose to investigate self-assembly of disilane molecules sandwiched between gold surface and gold nanoparticles.

These assemblies are found to exhibit covalent bonds not only between the anchoring Si groups and the gold surfaces but also in plane crosslinks that increase the monolayer stability.

Finally, using scanning tunneling spectroscopy we demonstrate that the disilane molecules provide strong electrical coupling between the Au nanoparticles and a superconductor substrate.

American Psychological Association (APA)

Yochelis, Shira& Katzir, Eran& Kalcheim, Yoav& Gutkin, Vitaly& Millo, Oded& Paltiel, Yossi. 2012. Formation of Au-Silane Bonds. Journal of Nanotechnology،Vol. 2012, no. 2012, pp.1-8.
https://search.emarefa.net/detail/BIM-506756

Modern Language Association (MLA)

Yochelis, Shira…[et al.]. Formation of Au-Silane Bonds. Journal of Nanotechnology No. 2012 (2012), pp.1-8.
https://search.emarefa.net/detail/BIM-506756

American Medical Association (AMA)

Yochelis, Shira& Katzir, Eran& Kalcheim, Yoav& Gutkin, Vitaly& Millo, Oded& Paltiel, Yossi. Formation of Au-Silane Bonds. Journal of Nanotechnology. 2012. Vol. 2012, no. 2012, pp.1-8.
https://search.emarefa.net/detail/BIM-506756

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-506756