A Circuit Model for CMOS Hall Cells Performance Evaluation including Temperature Effects

Joint Authors

Paun, Maria-Alexandra
Kayal, Maher
Sallese, Jean-Michel

Source

Advances in Condensed Matter Physics

Issue

Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-10, 10 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2013-09-15

Country of Publication

Egypt

No. of Pages

10

Main Subjects

Physics

Abstract EN

In order to provide the information on their Hall voltage, sensitivity, and drift with temperature, a new simpler lumped circuit model for the evaluation of various Hall cells has been developed.

In this sense, the finite element model proposed by the authors in this paper contains both geometrical parameters (dimensions of the cells) and physical parameters such as the mobility, conductivity, Hall factor, carrier concentration, and the temperature influence on them.

Therefore, a scalable finite element model in Cadence, for behavior simulation in circuit environment of CMOS Hall effect devices, with different shapes and technologies assessing their performance, has been elaborated.

American Psychological Association (APA)

Paun, Maria-Alexandra& Sallese, Jean-Michel& Kayal, Maher. 2013. A Circuit Model for CMOS Hall Cells Performance Evaluation including Temperature Effects. Advances in Condensed Matter Physics،Vol. 2013, no. 2013, pp.1-10.
https://search.emarefa.net/detail/BIM-512224

Modern Language Association (MLA)

Paun, Maria-Alexandra…[et al.]. A Circuit Model for CMOS Hall Cells Performance Evaluation including Temperature Effects. Advances in Condensed Matter Physics No. 2013 (2013), pp.1-10.
https://search.emarefa.net/detail/BIM-512224

American Medical Association (AMA)

Paun, Maria-Alexandra& Sallese, Jean-Michel& Kayal, Maher. A Circuit Model for CMOS Hall Cells Performance Evaluation including Temperature Effects. Advances in Condensed Matter Physics. 2013. Vol. 2013, no. 2013, pp.1-10.
https://search.emarefa.net/detail/BIM-512224

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-512224