Impact of thickness and heat treatment on some physical properties of thin Cu2 Sn S3 films

Abstract EN

Copper tin sulfide (Cu2SnS3) thin films have been grown on glass substrate with different thicknesses (500, 750 and 1000) nm by flash thermal evaporation method after prepare its alloy from their elements with high purity.

The as-deposited films were annealed at 473 K for 1h.

Compositional analysis was done using Energy dispersive spectroscopy (EDS).

The microstructure of CTS powder examined by SEM and found that the large crystal grains are shown clearly in images.

XRD investigation revealed that the alloy was polycrystalline nature and has cubic structure with preferred orientation along (111) plane, while as deposited films of different thickness have amorphous structure and converted to polycrystalline with annealing temperature for high thickness.

AFM measurements showed that the grain size of the films was increasing by annealing.

The ultraviolet- visible absorption spectrum measurement indicated that the films have a direct energy band gap.

Eg decrease with thickness and increase with annealing.