Effect of aging time on deformation behavior of lead-free and lead base solders alloys
Author
Source
Engineering and Technology Journal
Issue
Vol. 36, Issue 8A (31 Aug. 2018), pp.853-866, 14 p.
Publisher
Publication Date
2018-08-31
Country of Publication
Iraq
No. of Pages
14
Main Subjects
Abstract EN
The effect of aging time on the deformation behavior of lead-free and lead- based sub-mm solder alloys were investigated.
Experimental results showed that the aging time (less than 4 hours) did not have any effect on the anisotropy behavior of Tin solder balls during compression processes but that is clear in other intervals time specially when the aging time increased, and the microstructure images show different grain growth in high temperature longer time and the Tin anisotropic behavior in lead-free solder alloys.
American Psychological Association (APA)
al-Hamdani, Ala Husayn Ali. 2018. Effect of aging time on deformation behavior of lead-free and lead base solders alloys. Engineering and Technology Journal،Vol. 36, no. 8A, pp.853-866.
https://search.emarefa.net/detail/BIM-834115
Modern Language Association (MLA)
al-Hamdani, Ala Husayn Ali. Effect of aging time on deformation behavior of lead-free and lead base solders alloys. Engineering and Technology Journal Vol. 36, no. 8A (2018), pp.853-866.
https://search.emarefa.net/detail/BIM-834115
American Medical Association (AMA)
al-Hamdani, Ala Husayn Ali. Effect of aging time on deformation behavior of lead-free and lead base solders alloys. Engineering and Technology Journal. 2018. Vol. 36, no. 8A, pp.853-866.
https://search.emarefa.net/detail/BIM-834115
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references : p. 865-866
Record ID
BIM-834115