Cu nanostructures for enhanced heat transferin micro systems
Other Title(s)
أعمدة النحاس النانوية لتحسين انتقال الحرارة بالحمل الحر في الأنظمة الميكروية
Author
Source
Thi-Qar University Journal for Engineering Sciences
Issue
Vol. 8, Issue 3 (31 Dec. 2017), pp.66-80, 15 p.
Publisher
University of Thi-Qar College of Engineering
Publication Date
2017-12-31
Country of Publication
Iraq
No. of Pages
15
Main Subjects
Engineering & Technology Sciences (Multidisciplinary)
Abstract EN
Vertically aligned copper (Cu) nanorod arrays fabricated by glancing angle deposition (GLAD) technique was used to study the heat transfer by natural convection in micro systems.
These nanorods were deposited on Cu thin film surface, which was coated on Si (100) wafer substrates.
For comparison, planar Cu thin film samples were also produced by normal incidence deposition.
This study focuses on investigating experimentally the heat transfer by natural convection from the sample (nanostructured plate) to the surrounding air.
Newton's lawof cooling has been utilized to calculate thefree-convection heat transfer coefficient for Cu nanorods as well as Cu thin film.
Compered to Cu thin film samples, it has been found that the heat transfer coefficient values of Cu nanorods are higherdue to the enhanced heat transfer-surface area, which causes a significant reduction in thermal resistance.
These nanostructured surfaces offer an effective method of device cooling such as for small electronic devices, micro-reactors and air conditioning
American Psychological Association (APA)
Khudayr, Wisam J.. 2017. Cu nanostructures for enhanced heat transferin micro systems. Thi-Qar University Journal for Engineering Sciences،Vol. 8, no. 3, pp.66-80.
https://search.emarefa.net/detail/BIM-840116
Modern Language Association (MLA)
Khudayr, Wisam J.. Cu nanostructures for enhanced heat transferin micro systems. Thi-Qar University Journal for Engineering Sciences Vol. 8, no. 3 (2017), pp.66-80.
https://search.emarefa.net/detail/BIM-840116
American Medical Association (AMA)
Khudayr, Wisam J.. Cu nanostructures for enhanced heat transferin micro systems. Thi-Qar University Journal for Engineering Sciences. 2017. Vol. 8, no. 3, pp.66-80.
https://search.emarefa.net/detail/BIM-840116
Data Type
Journal Articles
Language
English
Notes
Includes appendices : p. 79-80
Record ID
BIM-840116