The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate

المؤلف

Hu, Hai-Ping

المصدر

Mathematical Problems in Engineering

العدد

المجلد 2015، العدد 2015 (31 ديسمبر/كانون الأول 2015)، ص ص. 1-9، 9ص.

الناشر

Hindawi Publishing Corporation

تاريخ النشر

2015-02-23

دولة النشر

مصر

عدد الصفحات

9

التخصصات الرئيسية

هندسة مدنية

الملخص EN

The aim of the present study is to investigate the two-dimensional heat transfer analysis in arrayed fins with thermal dissipation substrate.

The governing equations for the fins and the substrate are expressed with Laplace equations, and the boundary conditions around the fins and substrate are Robin conditions.

The present investigation first aims to provide a solution with regard to the geometry models by a series truncation method.

Then the research will compare the results of the series truncation method with the point-matching method.

Furthermore, the present study will also discuss the effects of dimension and Biot number of the fins on local dimensionless temperature, mean temperature, and heat transfer rate.

نمط استشهاد جمعية علماء النفس الأمريكية (APA)

Hu, Hai-Ping. 2015. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering،Vol. 2015, no. 2015, pp.1-9.
https://search.emarefa.net/detail/BIM-1074559

نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)

Hu, Hai-Ping. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering No. 2015 (2015), pp.1-9.
https://search.emarefa.net/detail/BIM-1074559

نمط استشهاد الجمعية الطبية الأمريكية (AMA)

Hu, Hai-Ping. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering. 2015. Vol. 2015, no. 2015, pp.1-9.
https://search.emarefa.net/detail/BIM-1074559

نوع البيانات

مقالات

لغة النص

الإنجليزية

الملاحظات

Includes bibliographical references

رقم السجل

BIM-1074559