The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate

Author

Hu, Hai-Ping

Source

Mathematical Problems in Engineering

Issue

Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-9, 9 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2015-02-23

Country of Publication

Egypt

No. of Pages

9

Main Subjects

Civil Engineering

Abstract EN

The aim of the present study is to investigate the two-dimensional heat transfer analysis in arrayed fins with thermal dissipation substrate.

The governing equations for the fins and the substrate are expressed with Laplace equations, and the boundary conditions around the fins and substrate are Robin conditions.

The present investigation first aims to provide a solution with regard to the geometry models by a series truncation method.

Then the research will compare the results of the series truncation method with the point-matching method.

Furthermore, the present study will also discuss the effects of dimension and Biot number of the fins on local dimensionless temperature, mean temperature, and heat transfer rate.

American Psychological Association (APA)

Hu, Hai-Ping. 2015. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering،Vol. 2015, no. 2015, pp.1-9.
https://search.emarefa.net/detail/BIM-1074559

Modern Language Association (MLA)

Hu, Hai-Ping. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering No. 2015 (2015), pp.1-9.
https://search.emarefa.net/detail/BIM-1074559

American Medical Association (AMA)

Hu, Hai-Ping. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering. 2015. Vol. 2015, no. 2015, pp.1-9.
https://search.emarefa.net/detail/BIM-1074559

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-1074559