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The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate
Author
Source
Mathematical Problems in Engineering
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-9, 9 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-02-23
Country of Publication
Egypt
No. of Pages
9
Main Subjects
Abstract EN
The aim of the present study is to investigate the two-dimensional heat transfer analysis in arrayed fins with thermal dissipation substrate.
The governing equations for the fins and the substrate are expressed with Laplace equations, and the boundary conditions around the fins and substrate are Robin conditions.
The present investigation first aims to provide a solution with regard to the geometry models by a series truncation method.
Then the research will compare the results of the series truncation method with the point-matching method.
Furthermore, the present study will also discuss the effects of dimension and Biot number of the fins on local dimensionless temperature, mean temperature, and heat transfer rate.
American Psychological Association (APA)
Hu, Hai-Ping. 2015. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering،Vol. 2015, no. 2015, pp.1-9.
https://search.emarefa.net/detail/BIM-1074559
Modern Language Association (MLA)
Hu, Hai-Ping. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering No. 2015 (2015), pp.1-9.
https://search.emarefa.net/detail/BIM-1074559
American Medical Association (AMA)
Hu, Hai-Ping. The Two-Dimensional Heat Transfer Analysis in Arrayed Fins with the Thermal Dissipation Substrate. Mathematical Problems in Engineering. 2015. Vol. 2015, no. 2015, pp.1-9.
https://search.emarefa.net/detail/BIM-1074559
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1074559