Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil
المؤلفون المشاركون
Nguyen, Manh Ha
Pham, Tien Duc
Nguyen, Hoang Hiep
Nguyen, Ngoc Viet
Vu, Thanh Tu
Pham, Thi Ngoc Mai
Doan, Thi Hai Yen
Ngo, Thi Mai Viet
المصدر
العدد
المجلد 2017، العدد 2017 (31 ديسمبر/كانون الأول 2017)، ص ص. 1-10، 10ص.
الناشر
Hindawi Publishing Corporation
تاريخ النشر
2017-03-02
دولة النشر
مصر
عدد الصفحات
10
التخصصات الرئيسية
الملخص EN
Removal of copper ion (Cu2+) by using surfactant modified laterite (SML) was investigated in the present study.
Characterizations of laterite were examined by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), inductively coupled plasma mass spectrometry (ICP-MS), and total carbon analysis.
The optimum conditions for removal of Cu2+ by adsorption using SML were systematically studied and found as pH 6, contact time 90 min, adsorbent dosage 5 mg/mL, and ionic strength 10 mM NaCl.
The equilibrium concentration of copper ions was measured by flame atomic absorption spectrometry (F-AAS).
Surface modification of laterite by anionic surfactant sodium dodecyl sulfate (SDS) induced a significant increase of the removal efficiency of Cu2+.
The surface modifications of laterite by preadsorption of SDS and sequential adsorption of Cu2+ were also evaluated by XRD and FT-IR.
The adsorption of Cu2+ onto SML increases with increasing NaCl concentration from 1 to 10 mM, but at high salt concentration this trend is reversed because desorption of SDS from laterite surface was enhanced by increasing salt concentration.
Experimental results of Cu2+/SML adsorption isotherms at different ionic strengths can be represented well by a two-step adsorption model.
Based on adsorption isotherms, surface charge effects, and surface modification, we suggest that the adsorption mechanism of Cu2+ onto SML was induced by electrostatic attraction between Cu2+ and the negatively charged SML surface and nonelectrostatic interactions between Cu2+ and organic substances in the laterite.
نمط استشهاد جمعية علماء النفس الأمريكية (APA)
Pham, Tien Duc& Nguyen, Hoang Hiep& Nguyen, Ngoc Viet& Vu, Thanh Tu& Pham, Thi Ngoc Mai& Doan, Thi Hai Yen…[et al.]. 2017. Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil. Journal of Chemistry،Vol. 2017, no. 2017, pp.1-10.
https://search.emarefa.net/detail/BIM-1171458
نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)
Pham, Tien Duc…[et al.]. Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil. Journal of Chemistry No. 2017 (2017), pp.1-10.
https://search.emarefa.net/detail/BIM-1171458
نمط استشهاد الجمعية الطبية الأمريكية (AMA)
Pham, Tien Duc& Nguyen, Hoang Hiep& Nguyen, Ngoc Viet& Vu, Thanh Tu& Pham, Thi Ngoc Mai& Doan, Thi Hai Yen…[et al.]. Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil. Journal of Chemistry. 2017. Vol. 2017, no. 2017, pp.1-10.
https://search.emarefa.net/detail/BIM-1171458
نوع البيانات
مقالات
لغة النص
الإنجليزية
الملاحظات
Includes bibliographical references
رقم السجل
BIM-1171458
قاعدة معامل التأثير والاستشهادات المرجعية العربي "ارسيف Arcif"
أضخم قاعدة بيانات عربية للاستشهادات المرجعية للمجلات العلمية المحكمة الصادرة في العالم العربي
تقوم هذه الخدمة بالتحقق من التشابه أو الانتحال في الأبحاث والمقالات العلمية والأطروحات الجامعية والكتب والأبحاث باللغة العربية، وتحديد درجة التشابه أو أصالة الأعمال البحثية وحماية ملكيتها الفكرية. تعرف اكثر