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Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil
Joint Authors
Nguyen, Manh Ha
Pham, Tien Duc
Nguyen, Hoang Hiep
Nguyen, Ngoc Viet
Vu, Thanh Tu
Pham, Thi Ngoc Mai
Doan, Thi Hai Yen
Ngo, Thi Mai Viet
Source
Issue
Vol. 2017, Issue 2017 (31 Dec. 2017), pp.1-10, 10 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2017-03-02
Country of Publication
Egypt
No. of Pages
10
Main Subjects
Abstract EN
Removal of copper ion (Cu2+) by using surfactant modified laterite (SML) was investigated in the present study.
Characterizations of laterite were examined by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), inductively coupled plasma mass spectrometry (ICP-MS), and total carbon analysis.
The optimum conditions for removal of Cu2+ by adsorption using SML were systematically studied and found as pH 6, contact time 90 min, adsorbent dosage 5 mg/mL, and ionic strength 10 mM NaCl.
The equilibrium concentration of copper ions was measured by flame atomic absorption spectrometry (F-AAS).
Surface modification of laterite by anionic surfactant sodium dodecyl sulfate (SDS) induced a significant increase of the removal efficiency of Cu2+.
The surface modifications of laterite by preadsorption of SDS and sequential adsorption of Cu2+ were also evaluated by XRD and FT-IR.
The adsorption of Cu2+ onto SML increases with increasing NaCl concentration from 1 to 10 mM, but at high salt concentration this trend is reversed because desorption of SDS from laterite surface was enhanced by increasing salt concentration.
Experimental results of Cu2+/SML adsorption isotherms at different ionic strengths can be represented well by a two-step adsorption model.
Based on adsorption isotherms, surface charge effects, and surface modification, we suggest that the adsorption mechanism of Cu2+ onto SML was induced by electrostatic attraction between Cu2+ and the negatively charged SML surface and nonelectrostatic interactions between Cu2+ and organic substances in the laterite.
American Psychological Association (APA)
Pham, Tien Duc& Nguyen, Hoang Hiep& Nguyen, Ngoc Viet& Vu, Thanh Tu& Pham, Thi Ngoc Mai& Doan, Thi Hai Yen…[et al.]. 2017. Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil. Journal of Chemistry،Vol. 2017, no. 2017, pp.1-10.
https://search.emarefa.net/detail/BIM-1171458
Modern Language Association (MLA)
Pham, Tien Duc…[et al.]. Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil. Journal of Chemistry No. 2017 (2017), pp.1-10.
https://search.emarefa.net/detail/BIM-1171458
American Medical Association (AMA)
Pham, Tien Duc& Nguyen, Hoang Hiep& Nguyen, Ngoc Viet& Vu, Thanh Tu& Pham, Thi Ngoc Mai& Doan, Thi Hai Yen…[et al.]. Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil. Journal of Chemistry. 2017. Vol. 2017, no. 2017, pp.1-10.
https://search.emarefa.net/detail/BIM-1171458
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1171458