Heat transfer in electronic systems printed circuit board : a review
المؤلفون المشاركون
al-Jubayr, Sattar
Kazim, Mustafa E.
Umran, Ahmad A.
المصدر
Engineering and Technology Journal
العدد
المجلد 40، العدد 1 (31 يناير/كانون الثاني 2022)، ص ص. 99-108، 10ص.
الناشر
تاريخ النشر
2022-01-31
دولة النشر
العراق
عدد الصفحات
10
التخصصات الرئيسية
الموضوعات
الملخص EN
Thermal regulation has now become a staple in the design of electronic devices.
as a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important.
due to the high demand for device performance and the need for better thermal management, this paper present a detailed theoretical review of heat transfer by conventional methods in electronic devices and equipment such as air cooling, water cooling, etc.
to provide an ideal framework for a practical application in electronic cooling.
with reference to the possibility of investing unconventional ways to reduce the energy consumed in the cooling process and preserving the environment through the possibility of replacing solid circuit boards with flexible circuits and studying their properties in improving heat transfer and deformation of P.
C.
B using the interaction of fluid structure under thermal and flow thermal regulation has now become a staple in the design of electronic devices.
as a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important.
due to the high demand for device performance and the need for better thermal management, this paper present a detailed theoretical review of heat transfer by conventional methods in electronic devices and equipment such as air cooling, water cooling, etc.
to provide an ideal framework for a practical application in electronic cooling.
with reference to the possibility of investing unconventional ways to reduce the energy consumed in the cooling process and preserving the environment through the possibility of replacing solid circuit boards with flexible circuits and studying their properties in improving heat transfer and deformation of p.
c.
b using the interaction of fluid structure under thermal and flow effects.
نمط استشهاد جمعية علماء النفس الأمريكية (APA)
Kazim, Mustafa E.& Umran, Ahmad A.& al-Jubayr, Sattar. 2022. Heat transfer in electronic systems printed circuit board : a review. Engineering and Technology Journal،Vol. 40, no. 1, pp.99-108.
https://search.emarefa.net/detail/BIM-1343083
نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)
Kazim, Mustafa E.…[et al.]. Heat transfer in electronic systems printed circuit board : a review. Engineering and Technology Journal Vol. 40, no. 1 (2022), pp.99-108.
https://search.emarefa.net/detail/BIM-1343083
نمط استشهاد الجمعية الطبية الأمريكية (AMA)
Kazim, Mustafa E.& Umran, Ahmad A.& al-Jubayr, Sattar. Heat transfer in electronic systems printed circuit board : a review. Engineering and Technology Journal. 2022. Vol. 40, no. 1, pp.99-108.
https://search.emarefa.net/detail/BIM-1343083
نوع البيانات
مقالات
لغة النص
الإنجليزية
الملاحظات
Includes bibliographical references : p. 106-108
رقم السجل
BIM-1343083
قاعدة معامل التأثير والاستشهادات المرجعية العربي "ارسيف Arcif"
أضخم قاعدة بيانات عربية للاستشهادات المرجعية للمجلات العلمية المحكمة الصادرة في العالم العربي
تقوم هذه الخدمة بالتحقق من التشابه أو الانتحال في الأبحاث والمقالات العلمية والأطروحات الجامعية والكتب والأبحاث باللغة العربية، وتحديد درجة التشابه أو أصالة الأعمال البحثية وحماية ملكيتها الفكرية. تعرف اكثر