Heat transfer in electronic systems printed circuit board : a review
Joint Authors
al-Jubayr, Sattar
Kazim, Mustafa E.
Umran, Ahmad A.
Source
Engineering and Technology Journal
Issue
Vol. 40, Issue 1 (31 Jan. 2022), pp.99-108, 10 p.
Publisher
Publication Date
2022-01-31
Country of Publication
Iraq
No. of Pages
10
Main Subjects
Topics
Abstract EN
Thermal regulation has now become a staple in the design of electronic devices.
as a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important.
due to the high demand for device performance and the need for better thermal management, this paper present a detailed theoretical review of heat transfer by conventional methods in electronic devices and equipment such as air cooling, water cooling, etc.
to provide an ideal framework for a practical application in electronic cooling.
with reference to the possibility of investing unconventional ways to reduce the energy consumed in the cooling process and preserving the environment through the possibility of replacing solid circuit boards with flexible circuits and studying their properties in improving heat transfer and deformation of P.
C.
B using the interaction of fluid structure under thermal and flow thermal regulation has now become a staple in the design of electronic devices.
as a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important.
due to the high demand for device performance and the need for better thermal management, this paper present a detailed theoretical review of heat transfer by conventional methods in electronic devices and equipment such as air cooling, water cooling, etc.
to provide an ideal framework for a practical application in electronic cooling.
with reference to the possibility of investing unconventional ways to reduce the energy consumed in the cooling process and preserving the environment through the possibility of replacing solid circuit boards with flexible circuits and studying their properties in improving heat transfer and deformation of p.
c.
b using the interaction of fluid structure under thermal and flow effects.
American Psychological Association (APA)
Kazim, Mustafa E.& Umran, Ahmad A.& al-Jubayr, Sattar. 2022. Heat transfer in electronic systems printed circuit board : a review. Engineering and Technology Journal،Vol. 40, no. 1, pp.99-108.
https://search.emarefa.net/detail/BIM-1343083
Modern Language Association (MLA)
Kazim, Mustafa E.…[et al.]. Heat transfer in electronic systems printed circuit board : a review. Engineering and Technology Journal Vol. 40, no. 1 (2022), pp.99-108.
https://search.emarefa.net/detail/BIM-1343083
American Medical Association (AMA)
Kazim, Mustafa E.& Umran, Ahmad A.& al-Jubayr, Sattar. Heat transfer in electronic systems printed circuit board : a review. Engineering and Technology Journal. 2022. Vol. 40, no. 1, pp.99-108.
https://search.emarefa.net/detail/BIM-1343083
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references : p. 106-108
Record ID
BIM-1343083