Selective electroless precipitation of copper on non - conductive surfaces using the semiconductor zinc oxide

الملخص EN

Zinc oxide layer being thermally precipitated on glass and ceramic strips (2 x 2.5 cm) before the electro less precipitation of copper utilizing the conventional Printed Circuit Boards (PCB) technologies in conjunction with the required modifications to optimize the quality of these layers.

The roughness of ZnO films was Ra 0.02 µm and its thickness about 0.7 µm.

The films being characterized by X-ray diffraction.

The bivalent Pd ( І І ) used as activator was reduced to Pd (0) on surface of ZnO layer by UV light in 1.5 – 2 minutes intervals.

Copper lines precipitated in the subsequent steps have an adhesion power of 2and 5 kg.mm-2 on glass and ceramic respectively.

The specific conductance of the electrolessly deposited copper was found to be (5.3 x 106) ohm-1.cm-1, and the resistivity was (1.8 x 10 -6) ohm.

CM.

From the results of this study the method could be utilized in PCB fabrication.