Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes

المؤلفون المشاركون

Hsieh, Hung-Lin
Hwu, Farn-Shiun

المصدر

Advances in Mechanical Engineering

العدد

المجلد 2013، العدد 2013 (31 ديسمبر/كانون الأول 2013)، ص ص. 1-5، 5ص.

الناشر

Hindawi Publishing Corporation

تاريخ النشر

2013-05-12

دولة النشر

مصر

عدد الصفحات

5

التخصصات الرئيسية

هندسة ميكانيكية

الملخص EN

The thermal characteristics of an alternating current light-emitting diode (AC LED) chip based on a three-dimensional unsteady numerical simulation are discussed.

In this model, the difficulties due to the tiny scale and extra-low aspect ratio of the AC LED microchip geometry are resolved.

A time lag between the maximum forward voltage and the highest mean junction temperature is observed.

The influence of different input power frequencies on the thermal fields is also investigated for AC LEDs with 600 μm × 600 μm area.

A numerical simulation of the junction temperature distributions shows that the AC LED has a better performance under a higher frequency than under a lower frequency.

نمط استشهاد جمعية علماء النفس الأمريكية (APA)

Hwu, Farn-Shiun& Hsieh, Hung-Lin. 2013. Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes. Advances in Mechanical Engineering،Vol. 2013, no. 2013, pp.1-5.
https://search.emarefa.net/detail/BIM-471308

نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)

Hwu, Farn-Shiun& Hsieh, Hung-Lin. Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes. Advances in Mechanical Engineering No. 2013 (2013), pp.1-5.
https://search.emarefa.net/detail/BIM-471308

نمط استشهاد الجمعية الطبية الأمريكية (AMA)

Hwu, Farn-Shiun& Hsieh, Hung-Lin. Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes. Advances in Mechanical Engineering. 2013. Vol. 2013, no. 2013, pp.1-5.
https://search.emarefa.net/detail/BIM-471308

نوع البيانات

مقالات

لغة النص

الإنجليزية

الملاحظات

Includes bibliographical references

رقم السجل

BIM-471308