Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes
Joint Authors
Hsieh, Hung-Lin
Hwu, Farn-Shiun
Source
Advances in Mechanical Engineering
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-5, 5 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-05-12
Country of Publication
Egypt
No. of Pages
5
Main Subjects
Abstract EN
The thermal characteristics of an alternating current light-emitting diode (AC LED) chip based on a three-dimensional unsteady numerical simulation are discussed.
In this model, the difficulties due to the tiny scale and extra-low aspect ratio of the AC LED microchip geometry are resolved.
A time lag between the maximum forward voltage and the highest mean junction temperature is observed.
The influence of different input power frequencies on the thermal fields is also investigated for AC LEDs with 600 μm × 600 μm area.
A numerical simulation of the junction temperature distributions shows that the AC LED has a better performance under a higher frequency than under a lower frequency.
American Psychological Association (APA)
Hwu, Farn-Shiun& Hsieh, Hung-Lin. 2013. Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes. Advances in Mechanical Engineering،Vol. 2013, no. 2013, pp.1-5.
https://search.emarefa.net/detail/BIM-471308
Modern Language Association (MLA)
Hwu, Farn-Shiun& Hsieh, Hung-Lin. Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes. Advances in Mechanical Engineering No. 2013 (2013), pp.1-5.
https://search.emarefa.net/detail/BIM-471308
American Medical Association (AMA)
Hwu, Farn-Shiun& Hsieh, Hung-Lin. Numerical Study of Thermal Behavior in Alternating Current Light-Emitting Diodes. Advances in Mechanical Engineering. 2013. Vol. 2013, no. 2013, pp.1-5.
https://search.emarefa.net/detail/BIM-471308
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-471308
