A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations

المؤلفون المشاركون

Postman, Jacob
Chiang, Patrick

المصدر

ISRN Electronics

العدد

المجلد 2012، العدد 2012 (31 ديسمبر/كانون الأول 2012)، ص ص. 1-9، 9ص.

الناشر

Hindawi Publishing Corporation

تاريخ النشر

2012-03-26

دولة النشر

مصر

عدد الصفحات

9

التخصصات الرئيسية

هندسة كهربائية

الملخص EN

Scaling CMOS process technology continues to enable increased levels of system integration, leading to on-chip communication demands beyond what traditional digital signaling techniques can efficiently provide with sufficient reliability.

In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, energy, and reliability and provide a review of interconnect reliability considerations.

Finally, we provide a case study to evaluate the efficiency of error correcting codes on a state-of-the-art energy-efficient low-swing interconnect.

نمط استشهاد جمعية علماء النفس الأمريكية (APA)

Postman, Jacob& Chiang, Patrick. 2012. A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations. ISRN Electronics،Vol. 2012, no. 2012, pp.1-9.
https://search.emarefa.net/detail/BIM-507833

نمط استشهاد الجمعية الأمريكية للغات الحديثة (MLA)

Postman, Jacob& Chiang, Patrick. A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations. ISRN Electronics No. 2012 (2012), pp.1-9.
https://search.emarefa.net/detail/BIM-507833

نمط استشهاد الجمعية الطبية الأمريكية (AMA)

Postman, Jacob& Chiang, Patrick. A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations. ISRN Electronics. 2012. Vol. 2012, no. 2012, pp.1-9.
https://search.emarefa.net/detail/BIM-507833

نوع البيانات

مقالات

لغة النص

الإنجليزية

الملاحظات

Includes bibliographical references

رقم السجل

BIM-507833