A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations

Joint Authors

Postman, Jacob
Chiang, Patrick

Source

ISRN Electronics

Issue

Vol. 2012, Issue 2012 (31 Dec. 2012), pp.1-9, 9 p.

Publisher

Hindawi Publishing Corporation

Publication Date

2012-03-26

Country of Publication

Egypt

No. of Pages

9

Main Subjects

Electronic engineering

Abstract EN

Scaling CMOS process technology continues to enable increased levels of system integration, leading to on-chip communication demands beyond what traditional digital signaling techniques can efficiently provide with sufficient reliability.

In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, energy, and reliability and provide a review of interconnect reliability considerations.

Finally, we provide a case study to evaluate the efficiency of error correcting codes on a state-of-the-art energy-efficient low-swing interconnect.

American Psychological Association (APA)

Postman, Jacob& Chiang, Patrick. 2012. A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations. ISRN Electronics،Vol. 2012, no. 2012, pp.1-9.
https://search.emarefa.net/detail/BIM-507833

Modern Language Association (MLA)

Postman, Jacob& Chiang, Patrick. A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations. ISRN Electronics No. 2012 (2012), pp.1-9.
https://search.emarefa.net/detail/BIM-507833

American Medical Association (AMA)

Postman, Jacob& Chiang, Patrick. A Survey Addressing On-Chip Interconnect : Energy and Reliability Considerations. ISRN Electronics. 2012. Vol. 2012, no. 2012, pp.1-9.
https://search.emarefa.net/detail/BIM-507833

Data Type

Journal Articles

Language

English

Notes

Includes bibliographical references

Record ID

BIM-507833