Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding
Joint Authors
Kim, Tae-Wan
Suk, Kyung-Lim
Lee, Sang-Hoon
Paik, Kyung-Wook
Source
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-10, 10 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-12-23
Country of Publication
Egypt
No. of Pages
10
Main Subjects
Abstract EN
In this study, solder ball incorporated polyvinylidenefluoride (PVDF) nanofiber was added into the ACF system to overcome short circuit issues of fine pitch flex-on-flex (FOF) assembly.
Also, in order to improve the thermal mismatch of the flexible substrate which can lead to electrode misalignment during the bonding process, low melting temperature Sn58Bi solder balls were used with vertical ultrasonic (U/S) bonding method.
When performing FOF assembly using PVDF nanofiber/Sn58Bi solder ACF and vertical ultrasonic bonding, PVDF nanofiber/Sn58Bi solder ACFs showed 34% higher solder capture rate on an electrode compared to conventional Ni ACFs and conventional Sn58Bi solder ACFs.
Additionally, PVDF nanofiber/Sn58Bisolder ACFs showed 100% insulation between neighboring electrodes where conventional Ni ACFs and conventional Sn58Bi solder ACFs showed 75% and 87.5% insulation.
Other electrical properties such as contact resistance and current handling capability as well as reliability test of PVDF nanofiber/Sn58Bi solder ACFs showed improved results compared to those of conventional Ni ACFs, which proves the formation of stable solder joint of PVDF nanofiber/Sn58Bi solder ACFs.
American Psychological Association (APA)
Kim, Tae-Wan& Suk, Kyung-Lim& Lee, Sang-Hoon& Paik, Kyung-Wook. 2013. Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding. Journal of Nanomaterials،Vol. 2013, no. 2013, pp.1-10.
https://search.emarefa.net/detail/BIM-1007926
Modern Language Association (MLA)
Kim, Tae-Wan…[et al.]. Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding. Journal of Nanomaterials No. 2013 (2013), pp.1-10.
https://search.emarefa.net/detail/BIM-1007926
American Medical Association (AMA)
Kim, Tae-Wan& Suk, Kyung-Lim& Lee, Sang-Hoon& Paik, Kyung-Wook. Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding. Journal of Nanomaterials. 2013. Vol. 2013, no. 2013, pp.1-10.
https://search.emarefa.net/detail/BIM-1007926
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1007926