Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process
Joint Authors
He, Xueming
Jianhua, Zhou
Jianzhong, Jiang
Source
Advances in Materials Science and Engineering
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-11-25
Country of Publication
Egypt
No. of Pages
6
Abstract EN
By theoretical calculation, the external force on the particle conveyed by pad asperities and the molecular adhesion force between particle and wafer are compared and analyzed quantitatively.
It is confirmed that the molecular adhesion force between particle and wafer has a great influence on the chemical mechanical polishing (CMP) material removal process.
Considering the molecular adhesion force between particle and wafer, a more precise model for the indentation of a particle into the wafer surface is developed in this paper, and the new model is compared with the former model which neglected the molecular adhesion force.
Through theoretical analyses, an approach and corresponding critical values are applied to estimate whether the molecular adhesion force in CMP can be neglected.
These methods can improve the precision of the material removal model of CMP.
American Psychological Association (APA)
Jianhua, Zhou& Jianzhong, Jiang& He, Xueming. 2014. Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process. Advances in Materials Science and Engineering،Vol. 2014, no. 2014, pp.1-6.
https://search.emarefa.net/detail/BIM-1015798
Modern Language Association (MLA)
Jianhua, Zhou…[et al.]. Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process. Advances in Materials Science and Engineering No. 2014 (2014), pp.1-6.
https://search.emarefa.net/detail/BIM-1015798
American Medical Association (AMA)
Jianhua, Zhou& Jianzhong, Jiang& He, Xueming. Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process. Advances in Materials Science and Engineering. 2014. Vol. 2014, no. 2014, pp.1-6.
https://search.emarefa.net/detail/BIM-1015798
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1015798