Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
Joint Authors
Abdul Aziz, M. S.
Abdullah, M. Z.
Khor, C. Y.
Source
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-13, 13 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-08-13
Country of Publication
Egypt
No. of Pages
13
Main Subjects
Medicine
Information Technology and Computer Science
Abstract EN
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering.
This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material.
A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT.
The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) < T < 643.15 K (370°C).
Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis.
In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin.
Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress.
Filling time exhibited a quadratic relationship to the increment of temperature.
The deformation of pin showed a linear correlation to the temperature.
The ΔT obtained from the simulation and the experimental method were validated.
This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.
American Psychological Association (APA)
Abdul Aziz, M. S.& Abdullah, M. Z.& Khor, C. Y.. 2014. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis. The Scientific World Journal،Vol. 2014, no. 2014, pp.1-13.
https://search.emarefa.net/detail/BIM-1049776
Modern Language Association (MLA)
Abdul Aziz, M. S.…[et al.]. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis. The Scientific World Journal No. 2014 (2014), pp.1-13.
https://search.emarefa.net/detail/BIM-1049776
American Medical Association (AMA)
Abdul Aziz, M. S.& Abdullah, M. Z.& Khor, C. Y.. Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis. The Scientific World Journal. 2014. Vol. 2014, no. 2014, pp.1-13.
https://search.emarefa.net/detail/BIM-1049776
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1049776