Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
Joint Authors
Huang, Hong-Zhong
Mi, Jinhua
Yang, Yuan-Jian
Peng, Weiwen
Li, Yan-Feng
Source
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-11, 11 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-07-08
Country of Publication
Egypt
No. of Pages
11
Main Subjects
Medicine
Information Technology and Computer Science
Abstract EN
Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure.
Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull distribution are investigated.
The type-I interval censored lifetime data were collected from a thermal cycling test, which was implemented on microelectronic packaging with lead-free ball grid array (BGA) and fine-pitch ball grid array (FBGA) interconnection structures.
The number of cycles to failure of lead-free solder joints is predicted by using a modified Engelmaier fatigue life model and a type-I censored data processing method.
Then, the Pan model is employed to calculate the acceleration factor of this test.
A comparison of life predictions between the proposed method and the ones calculated directly by Matlab and Minitab is conducted to demonstrate the practicability and effectiveness of the proposed method.
At last, failure analysis and microstructure evolution of lead-free solders are carried out to provide useful guidance for the regular maintenance, replacement of substructure, and subsequent processing of electronic products.
American Psychological Association (APA)
Mi, Jinhua& Li, Yan-Feng& Yang, Yuan-Jian& Peng, Weiwen& Huang, Hong-Zhong. 2014. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data. The Scientific World Journal،Vol. 2014, no. 2014, pp.1-11.
https://search.emarefa.net/detail/BIM-1051129
Modern Language Association (MLA)
Mi, Jinhua…[et al.]. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data. The Scientific World Journal No. 2014 (2014), pp.1-11.
https://search.emarefa.net/detail/BIM-1051129
American Medical Association (AMA)
Mi, Jinhua& Li, Yan-Feng& Yang, Yuan-Jian& Peng, Weiwen& Huang, Hong-Zhong. Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data. The Scientific World Journal. 2014. Vol. 2014, no. 2014, pp.1-11.
https://search.emarefa.net/detail/BIM-1051129
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1051129