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Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging
Joint Authors
Source
Advances in Materials Science and Engineering
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-16, 16 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-02-18
Country of Publication
Egypt
No. of Pages
16
Abstract EN
SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties.
However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability.
In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparticles to the SnAgCu solders.
In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.
American Psychological Association (APA)
Sun, Lei& Zhang, Liang. 2015. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging. Advances in Materials Science and Engineering،Vol. 2015, no. 2015, pp.1-16.
https://search.emarefa.net/detail/BIM-1053587
Modern Language Association (MLA)
Sun, Lei& Zhang, Liang. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging. Advances in Materials Science and Engineering No. 2015 (2015), pp.1-16.
https://search.emarefa.net/detail/BIM-1053587
American Medical Association (AMA)
Sun, Lei& Zhang, Liang. Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging. Advances in Materials Science and Engineering. 2015. Vol. 2015, no. 2015, pp.1-16.
https://search.emarefa.net/detail/BIM-1053587
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1053587