Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration
Joint Authors
Kang, Ting
Zhang, Wei
Wang, Jianwei
Yan, Zhaowen
Source
International Journal of Antennas and Propagation
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-14, 14 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-12-03
Country of Publication
Egypt
No. of Pages
14
Main Subjects
Abstract EN
Convergence of multiple functions in a single device is the main thought behind the development of the current electronic trends.
So, the requirement for higher integration in electronic devices has become more important in present days than in the past.
Through silicon via (TSV) is the latest interconnect technology proposed mainly for higher integration and higher frequency.
Therefore, cross talk will be an essential issue that needs to be taken into consideration.
In this paper, we study the electrical property of a GSSG (S-Signal, G-Ground) TSV structure and propose the accurate lumped model which can be used to predict the TSV performance.
Since more dies are used within one chip, the single layer TSV cannot satisfy the requirement.
Hence, we propose the multilayer TSV structure and study how the bump radius, bump height, and underfill material affect the TSV transmission performance and coupling issue, so that we can conduct a good TSV design.
Furthermore, three multilayer 4 × 4 TSV array models are proposed with different GS distribution to analyze the detailed coupling results.
American Psychological Association (APA)
Yan, Zhaowen& Kang, Ting& Zhang, Wei& Wang, Jianwei. 2015. Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration. International Journal of Antennas and Propagation،Vol. 2015, no. 2015, pp.1-14.
https://search.emarefa.net/detail/BIM-1065087
Modern Language Association (MLA)
Yan, Zhaowen…[et al.]. Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration. International Journal of Antennas and Propagation No. 2015 (2015), pp.1-14.
https://search.emarefa.net/detail/BIM-1065087
American Medical Association (AMA)
Yan, Zhaowen& Kang, Ting& Zhang, Wei& Wang, Jianwei. Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration. International Journal of Antennas and Propagation. 2015. Vol. 2015, no. 2015, pp.1-14.
https://search.emarefa.net/detail/BIM-1065087
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1065087