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The Reliability Improvement of Cu Interconnection by the Control of Crystallized α - TaTaN x Diffusion Barrier
Joint Authors
Chen, Wei-Chun
Chien, Hung Ju
Ying, Tzung Hua
Wang, Wei-Lin
Wang, Chia-Ti
Peng, Kuo-Tzu
Yeh, Ming-Hsin
Kuo, Hsien-Chang
Chuang, Jen-Chi
Source
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-07-01
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Abstract EN
Ta/TaN bilayers have been deposited by a commercial self-ionized plasma (SIP) system.
The microstructures of Ta/TaN bilayers have been systematically characterized by X-ray diffraction patterns and cross-sectional transmission electron microscopy.
TaN films deposited by SIP system are amorphous.
The crystalline behavior of Ta film can be controlled by the N concentration of underlying TaN film.
On amorphous TaN film with low N concentration, overdeposited Ta film is the mixture of α- and β-phases with amorphous-like structure.
Increasing the N concentration of amorphous TaN underlayer successfully leads upper Ta film to form pure α-phase.
For the practical application, the electrical property and reliability of Cu interconnection structure have been investigated by utilizing various types of Ta/TaN diffusion barrier.
The diffusion barrier fabricated by the combination of crystallized α-Ta and TaN with high N concentration efficiently reduces the KRc and improves the EM resistance of Cu interconnection structure.
American Psychological Association (APA)
Wang, Wei-Lin& Wang, Chia-Ti& Chen, Wei-Chun& Peng, Kuo-Tzu& Yeh, Ming-Hsin& Kuo, Hsien-Chang…[et al.]. 2015. The Reliability Improvement of Cu Interconnection by the Control of Crystallized α - TaTaN x Diffusion Barrier. Journal of Nanomaterials،Vol. 2015, no. 2015, pp.1-6.
https://search.emarefa.net/detail/BIM-1069432
Modern Language Association (MLA)
Wang, Wei-Lin…[et al.]. The Reliability Improvement of Cu Interconnection by the Control of Crystallized α - TaTaN x Diffusion Barrier. Journal of Nanomaterials No. 2015 (2015), pp.1-6.
https://search.emarefa.net/detail/BIM-1069432
American Medical Association (AMA)
Wang, Wei-Lin& Wang, Chia-Ti& Chen, Wei-Chun& Peng, Kuo-Tzu& Yeh, Ming-Hsin& Kuo, Hsien-Chang…[et al.]. The Reliability Improvement of Cu Interconnection by the Control of Crystallized α - TaTaN x Diffusion Barrier. Journal of Nanomaterials. 2015. Vol. 2015, no. 2015, pp.1-6.
https://search.emarefa.net/detail/BIM-1069432
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1069432