The Variations of Thermal Contact Resistance and Heat Transfer Rate of the AlN Film Compositing with PCM
Joint Authors
Chang, Yuh-Ping
Wang, Jin-Chi
Chou, Huann-Ming
Source
Mathematical Problems in Engineering
Issue
Vol. 2015, Issue 2015 (31 Dec. 2015), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2015-10-11
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
The electrical industries have been fast developing over the past decades.
Moreover, the trend of microelements and packed division multiplex is obviously for the electrical industry.
Hence, the high heat dissipative and the electrical insulating device have been popular and necessary.
The thermal conduct coefficient of aluminum nitride (i.e., AlN) is many times larger than the other materials.
Moreover, the green technology of composite with phase change materials (i.e., PCMs) is worked as a constant temperature cooler.
Therefore, PCMs have been used frequently for saving energy and the green environment.
Based on the above statements, it does show great potential in heat dissipative for the AlN film compositing with PCM.
Therefore, this paper is focused on the research of thermal contact resistance and heat transfer between the AlN/PCM pairs.
According to the experimental results, the heat transfer decreases and the thermal contact resistance increases under the melting process of PCM.
However, the suitable parameters such as contact pressures can be used to improve the above defects.
American Psychological Association (APA)
Chou, Huann-Ming& Wang, Jin-Chi& Chang, Yuh-Ping. 2015. The Variations of Thermal Contact Resistance and Heat Transfer Rate of the AlN Film Compositing with PCM. Mathematical Problems in Engineering،Vol. 2015, no. 2015, pp.1-8.
https://search.emarefa.net/detail/BIM-1073119
Modern Language Association (MLA)
Chou, Huann-Ming…[et al.]. The Variations of Thermal Contact Resistance and Heat Transfer Rate of the AlN Film Compositing with PCM. Mathematical Problems in Engineering No. 2015 (2015), pp.1-8.
https://search.emarefa.net/detail/BIM-1073119
American Medical Association (AMA)
Chou, Huann-Ming& Wang, Jin-Chi& Chang, Yuh-Ping. The Variations of Thermal Contact Resistance and Heat Transfer Rate of the AlN Film Compositing with PCM. Mathematical Problems in Engineering. 2015. Vol. 2015, no. 2015, pp.1-8.
https://search.emarefa.net/detail/BIM-1073119
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1073119