Diffusion bonding of 7017 al-alloy

Abstract EN

Direct diffusion bonding (DB) of 1011 Al-alloy has been investigated in Argon atmosphere for various temperatures, pressures and times.

Indirect diffusion bond was also applied in Argon atmosphere using a pure copper foil as an interlayer; the tests were performed at temperatures of 450 °C, 520°C and 550°C.

A transient liquid phase (eutectic) formed between aluminium and copper at time of 60 min.

at 550°C in which good metallurgical bond was achieved for copper interlayered bonds.

However, poor bond was obtained for plain bonds and a maximum of 117 MPa tensile strength was achieved.

Poor bonding was attributed to the oxide film present on the faying surfaces