Rapid Formation of Kinetically Sprayed Cu-Sn Intermetallic Film
Joint Authors
Choi, Dahyun
Lee, Caroline Sunyong
Kang, Suhee
Kim, Hyungsub
Kim, Hyojun
Source
Issue
Vol. 2019, Issue 2019 (31 Dec. 2019), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2019-10-21
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Abstract EN
The kinetically spraying method was used to fabricate an in situ copper- (Cu-) tin (Sn) intermetallic compound (IMC) film with its thickness of approximately 1 μm using a Cu-Sn mixed powder.
Microsized Cu (~5 μm) and Sn (~10 μm) powders were mixed at its ratio of 45 : 55 wt.%, respectively, and then deposited onto a silicon substrate, forming an IMC layer.
The actual composition of the deposited film was measured to be at a Cu : Sn ratio of 36 : 64 wt.% (in situ kinetically sprayed at 200°C).
This kinetically sprayed process uses the energy source of collision and heat energy simultaneously, leading to the formation of an IMC phase.
The IMC phase of Cu6Sn5 was formed successfully within 3 minutes of in situ deposition.
Moreover, we obtained a Cu6Sn5 phase when the thin film was annealed in a furnace for 1 hour immediately after kinetically spraying at room temperature.
However, an IMC phase was not formed in the thin film when kinetically sprayed at room temperature followed by heating on a hot plate for 3 minutes.
It seems that the simultaneous supply of collision and heat energy is crucial to result in phase formation.
Therefore, we have proven that the kinetically spraying process is capable of fabricating a super-thin layer of IMC film within a short time.
American Psychological Association (APA)
Choi, Dahyun& Kang, Suhee& Kim, Hyungsub& Kim, Hyojun& Lee, Caroline Sunyong. 2019. Rapid Formation of Kinetically Sprayed Cu-Sn Intermetallic Film. Journal of Nanomaterials،Vol. 2019, no. 2019, pp.1-6.
https://search.emarefa.net/detail/BIM-1182287
Modern Language Association (MLA)
Choi, Dahyun…[et al.]. Rapid Formation of Kinetically Sprayed Cu-Sn Intermetallic Film. Journal of Nanomaterials No. 2019 (2019), pp.1-6.
https://search.emarefa.net/detail/BIM-1182287
American Medical Association (AMA)
Choi, Dahyun& Kang, Suhee& Kim, Hyungsub& Kim, Hyojun& Lee, Caroline Sunyong. Rapid Formation of Kinetically Sprayed Cu-Sn Intermetallic Film. Journal of Nanomaterials. 2019. Vol. 2019, no. 2019, pp.1-6.
https://search.emarefa.net/detail/BIM-1182287
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1182287