Ohmic Contact Mechanism for NiC-Faced 4H-n-SiC Substrate
Joint Authors
Cuong, Tran V.
Kim, Seongjun
Kim, Hong-Ki
Lim, Minwho
Jeong, Seonghoon
Kang, Min-Jae
Kang, Min-Sik
Lee, Nam-Suk
Kim, Hyunsoo
Erlbacher, Tobias
Bauer, Anton
Shin, Hoon-Kyu
Source
Issue
Vol. 2019, Issue 2019 (31 Dec. 2019), pp.1-5, 5 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2019-12-05
Country of Publication
Egypt
No. of Pages
5
Main Subjects
Abstract EN
In this work, the ohmic contact mechanism of Ni electrodes on C-faced 4H-n-SiC was investigated by evaluating the electrical and microstructural properties in the contact interface as a function of annealing temperatures ranging from 950 to 1100°C.
We determined that Ni-silicide, especially the NiSi phase, plays a key role in the formation of ohmic contacts rather than an increase in carbon vacancies in the C-faced SiC substrate.
A vertically oriented NiSi phase was observed in the thermally annealed sample at the optimized temperature that behaves as a current path.
A further increase in annealing temperature leads to the degradation of ohmic behavior due to the formation of horizontal-type NiSi in the Ni-rich Ni-silicide/NiSi/SiC structure.
American Psychological Association (APA)
Kim, Seongjun& Kim, Hong-Ki& Lim, Minwho& Jeong, Seonghoon& Kang, Min-Jae& Kang, Min-Sik…[et al.]. 2019. Ohmic Contact Mechanism for NiC-Faced 4H-n-SiC Substrate. Journal of Nanomaterials،Vol. 2019, no. 2019, pp.1-5.
https://search.emarefa.net/detail/BIM-1182451
Modern Language Association (MLA)
Kim, Seongjun…[et al.]. Ohmic Contact Mechanism for NiC-Faced 4H-n-SiC Substrate. Journal of Nanomaterials No. 2019 (2019), pp.1-5.
https://search.emarefa.net/detail/BIM-1182451
American Medical Association (AMA)
Kim, Seongjun& Kim, Hong-Ki& Lim, Minwho& Jeong, Seonghoon& Kang, Min-Jae& Kang, Min-Sik…[et al.]. Ohmic Contact Mechanism for NiC-Faced 4H-n-SiC Substrate. Journal of Nanomaterials. 2019. Vol. 2019, no. 2019, pp.1-5.
https://search.emarefa.net/detail/BIM-1182451
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1182451