Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys
Joint Authors
Liu, Zhongying
Mao, Feng
Li, Shuai
Wang, Xingxing
Jiu, Yongtao
Luo, Jingyi
Shangguan, Linjian
Jin, Xiangjie
Zhang, Shuye
He, Peng
Long, Weimin
Wu, Gang
Source
Issue
Vol. 2020, Issue 2020 (31 Dec. 2020), pp.1-25, 25 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2020-12-14
Country of Publication
Egypt
No. of Pages
25
Main Subjects
Abstract EN
With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders.
And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties.
In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys.
Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized.
It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys.
Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.
American Psychological Association (APA)
Li, Shuai& Wang, Xingxing& Liu, Zhongying& Mao, Feng& Jiu, Yongtao& Luo, Jingyi…[et al.]. 2020. Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys. Journal of Nanomaterials،Vol. 2020, no. 2020, pp.1-25.
https://search.emarefa.net/detail/BIM-1188595
Modern Language Association (MLA)
Li, Shuai…[et al.]. Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys. Journal of Nanomaterials No. 2020 (2020), pp.1-25.
https://search.emarefa.net/detail/BIM-1188595
American Medical Association (AMA)
Li, Shuai& Wang, Xingxing& Liu, Zhongying& Mao, Feng& Jiu, Yongtao& Luo, Jingyi…[et al.]. Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys. Journal of Nanomaterials. 2020. Vol. 2020, no. 2020, pp.1-25.
https://search.emarefa.net/detail/BIM-1188595
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1188595