Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry
Joint Authors
Hur, Sun
Ahn, Gilseung
Park, Myunghwan
Park, You-Jin
Source
Mathematical Problems in Engineering
Issue
Vol. 2019, Issue 2019 (31 Dec. 2019), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2019-02-18
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
In semiconductor back-end production, the die attach process is one of the most critical steps affecting overall productivity.
Optimization of this process can be modeled as a pick-and-place problem known to be NP-hard.
Typical approaches are rule-based and metaheuristic methods.
The two have high or low generalization ability, low or high performance, and short or long search time, respectively.
The motivation of this paper is to develop a novel method involving only the strengths of these methods, i.e., high generalization ability and performance and short search time.
We develop an interactive Q-learning in which two agents, a pick agent and a place agent, are trained and find a pick-and-place (PAP) path interactively.
From experiments, we verified that the proposed approach finds a shorter path than the genetic algorithm given in previous research.
American Psychological Association (APA)
Ahn, Gilseung& Park, Myunghwan& Park, You-Jin& Hur, Sun. 2019. Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry. Mathematical Problems in Engineering،Vol. 2019, no. 2019, pp.1-8.
https://search.emarefa.net/detail/BIM-1195691
Modern Language Association (MLA)
Ahn, Gilseung…[et al.]. Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry. Mathematical Problems in Engineering No. 2019 (2019), pp.1-8.
https://search.emarefa.net/detail/BIM-1195691
American Medical Association (AMA)
Ahn, Gilseung& Park, Myunghwan& Park, You-Jin& Hur, Sun. Interactive Q-Learning Approach for Pick-and-Place Optimization of the Die Attach Process in the Semiconductor Industry. Mathematical Problems in Engineering. 2019. Vol. 2019, no. 2019, pp.1-8.
https://search.emarefa.net/detail/BIM-1195691
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1195691