![](/images/graphics-bg.png)
Thermal Stress Analysis of Chip Scale Packaging by Using Novel Multiscale Interface Element Method
Joint Authors
Liu, D. S.
Chen, Y. W.
Tsai, C. Y.
Source
Mathematical Problems in Engineering
Issue
Vol. 2018, Issue 2018 (31 Dec. 2018), pp.1-10, 10 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2018-10-21
Country of Publication
Egypt
No. of Pages
10
Main Subjects
Abstract EN
In this study, a multiscale interface element method (MIEM) is developed to evaluate the interfacial peel and shear stress distributions in multilayer packaging structures.
A newly developed polygon interface element contained many sides that could easily connect with many other polygon elements of much smaller scale.
Simple model and less computation can obtain accurate stress distributions.
After verification of the validity of the developed model, MIEM is applied to analyze thermal stress distribution of the chip scale package (CSP).
In general, a good qualitative agreement has been observed between the various results.
Moreover, MIEM can directly obtain the stress value at the interface, which is also one of the advantages of this method in dealing with multilayer structures.
American Psychological Association (APA)
Liu, D. S.& Chen, Y. W.& Tsai, C. Y.. 2018. Thermal Stress Analysis of Chip Scale Packaging by Using Novel Multiscale Interface Element Method. Mathematical Problems in Engineering،Vol. 2018, no. 2018, pp.1-10.
https://search.emarefa.net/detail/BIM-1207762
Modern Language Association (MLA)
Liu, D. S.…[et al.]. Thermal Stress Analysis of Chip Scale Packaging by Using Novel Multiscale Interface Element Method. Mathematical Problems in Engineering No. 2018 (2018), pp.1-10.
https://search.emarefa.net/detail/BIM-1207762
American Medical Association (AMA)
Liu, D. S.& Chen, Y. W.& Tsai, C. Y.. Thermal Stress Analysis of Chip Scale Packaging by Using Novel Multiscale Interface Element Method. Mathematical Problems in Engineering. 2018. Vol. 2018, no. 2018, pp.1-10.
https://search.emarefa.net/detail/BIM-1207762
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-1207762