![](/images/graphics-bg.png)
Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu : A Review
Joint Authors
Lee, Liu Mei
Mohamad, Ahmad Azmin
Source
Advances in Materials Science and Engineering
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-11, 11 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-03-14
Country of Publication
Egypt
No. of Pages
11
Main Subjects
Engineering Sciences and Information Technology
Abstract EN
This paper reviews the function and importance of Sn-Ag-Cu solder alloys in electronics industry and the interfacial reaction of Sn-Ag-Cu/Cu solder joint at various solder forms and solder reflow conditions.
The Sn-Ag-Cu solder alloys are examined in bulk and in thin film.
It then examines the effect of soldering conditions to the formation of intermetallic compounds such as Cu substrate selection, structural phases, morphology evolution, the growth kinetics, temperature and time is also discussed.
Sn-Ag-Cu lead-free solder alloys are the most promising candidate for the replacement of Sn-Pb solders in modern microelectronic technology.
Sn-Ag-Cu solders could possibly be considered and adapted in miniaturization technologies.
Therefore, this paper should be of great interest to a large selection of electronics interconnect materials, reliability, processes, and assembly community.
American Psychological Association (APA)
Lee, Liu Mei& Mohamad, Ahmad Azmin. 2013. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu : A Review. Advances in Materials Science and Engineering،Vol. 2013, no. 2013, pp.1-11.
https://search.emarefa.net/detail/BIM-447437
Modern Language Association (MLA)
Lee, Liu Mei& Mohamad, Ahmad Azmin. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu : A Review. Advances in Materials Science and Engineering No. 2013 (2013), pp.1-11.
https://search.emarefa.net/detail/BIM-447437
American Medical Association (AMA)
Lee, Liu Mei& Mohamad, Ahmad Azmin. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu : A Review. Advances in Materials Science and Engineering. 2013. Vol. 2013, no. 2013, pp.1-11.
https://search.emarefa.net/detail/BIM-447437
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-447437