Analysis of CNT Bundle and Its Comparison with Copper Interconnect for CMOS and CNFET Drivers
Joint Authors
Hasan, Mohd.
Kureshi, Abdul Kadir
Source
Issue
Vol. 2009, Issue 2009 (31 Dec. 2009), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2009-10-20
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Engineering Sciences and Information Technology
Chemistry
Civil Engineering
Abstract EN
In nanoscale regime as the CMOS process technology continues to scale, the standard copper (Cu) interconnect will become a major hurdle for onchip communication due to high resistivity and electromigration.
This paper presents the comprehensive evaluation of mixed CNT bundle interconnects and investigates their prospects as a low power high-speed interconnect for future nanoscale-integrated circuits.
The performance of mixed CNT bundle interconnect is examined with carbon nanotube field effect transistor (CNFET) as a driver and compared with the traditional interconnect, that is, CMOS driver on Cu interconnect.
All HSPICE simulations are carried out at operating frequency of 1 GHz and it is found that mixed CNT bundle interconnects with CNFET as the driver can potentially provide a substantial delay reduction over traditional interconnects implemented at 32 nm process technology.
Similarly, the CNFET driver with mixed CNT bundle as interconnect is more energy efficient than the traditional interconnect at all supply voltages (VDD) from 0.9 V to 0.3 V.
American Psychological Association (APA)
Kureshi, Abdul Kadir& Hasan, Mohd.. 2009. Analysis of CNT Bundle and Its Comparison with Copper Interconnect for CMOS and CNFET Drivers. Journal of Nanomaterials،Vol. 2009, no. 2009, pp.1-6.
https://search.emarefa.net/detail/BIM-475529
Modern Language Association (MLA)
Kureshi, Abdul Kadir& Hasan, Mohd.. Analysis of CNT Bundle and Its Comparison with Copper Interconnect for CMOS and CNFET Drivers. Journal of Nanomaterials No. 2009 (2009), pp.1-6.
https://search.emarefa.net/detail/BIM-475529
American Medical Association (AMA)
Kureshi, Abdul Kadir& Hasan, Mohd.. Analysis of CNT Bundle and Its Comparison with Copper Interconnect for CMOS and CNFET Drivers. Journal of Nanomaterials. 2009. Vol. 2009, no. 2009, pp.1-6.
https://search.emarefa.net/detail/BIM-475529
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-475529