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Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board
Joint Authors
Zhou, Jing
Long, Xing-ming
Liao, Rui-jin
Source
Issue
Vol. 2012, Issue 2012 (31 Dec. 2012), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2012-10-24
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Abstract EN
The electrical-thermal characteristics of gallium-nitride- (GaN-) based light-emitting diodes (LED), packaged by chips embedded in board (EIB) technology, were investigated using a multiphysics and multiscale finite element code, COMSOL.
Three-dimensional (3D) finite element model for packaging structure has been developed and optimized with forward-voltage-based junction temperatures of a 9-chip EIB sample.
The sensitivity analysis of the simulation model has been conducted to estimate the current and temperature distribution changes in EIB LED as the blue LED chip (substrate, indium tin oxide (ITO)), packaging structure (bonding wire and chip numbers), and system condition (injection current) changed.
This method proved the reliability of simulated results in advance and useful material parameters.
Furthermore, the method suggests that the parameter match on Shockley's equation parameters, Rs, nideal, and Is, is a potential method to reduce the current crowding effect for the EIB LED.
Junction temperature decreases by approximately 3 K to 10 K can be achieved by substrate thinning, ITO, and wire bonding.
The nonlinear-decreasing characteristics of total thermal resistance that decrease with an increase in chip numbers are likely to improve the thermal performance of EIB LED modules.
American Psychological Association (APA)
Long, Xing-ming& Liao, Rui-jin& Zhou, Jing. 2012. Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board. Advances in OptoElectronics،Vol. 2012, no. 2012, pp.1-6.
https://search.emarefa.net/detail/BIM-476272
Modern Language Association (MLA)
Long, Xing-ming…[et al.]. Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board. Advances in OptoElectronics No. 2012 (2012), pp.1-6.
https://search.emarefa.net/detail/BIM-476272
American Medical Association (AMA)
Long, Xing-ming& Liao, Rui-jin& Zhou, Jing. Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board. Advances in OptoElectronics. 2012. Vol. 2012, no. 2012, pp.1-6.
https://search.emarefa.net/detail/BIM-476272
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-476272