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Fuzzy TOPSIS for Multiresponse Quality Problems in Wafer Fabrication Processes
Joint Authors
Liu, Chiun-Ming
Chuang, Wen-Chieh
Ji, Mei-Yu
Source
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-05-12
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Information Technology and Computer Science
Abstract EN
The quality characteristics in the wafer fabrication process are diverse, variable, and fuzzy in nature.
How to effectively deal with multiresponse quality problems in the wafer fabrication process is a challenging task.
In this study, the fuzzy technique for order preference by similarity to an ideal solution (TOPSIS), one of the fuzzy multiattribute decision-analysis (MADA) methods, is proposed to investigate the fuzzy multiresponse quality problem in integrated-circuit (IC) wafer fabrication process.
The fuzzy TOPSIS is one of the effective fuzzy MADA methods for dealing with decision-making problems under uncertain environments.
First, a fuzzy TOPSIS methodology is developed by considering the ambiguity between quality characteristics.
Then, a detailed procedure for the developed fuzzy TOPSIS approach is presented to show how the fuzzy wafer fabrication quality problems can be solved.
Real-world data is collected from an IC semiconductor company and the developed fuzzy TOPSIS approach is applied to find an optimal combination of parameters.
Results of this study show that the developed approach provides a satisfactory solution to the wafer fabrication multiresponse problem.
This developed approach can be also applied to other industries for investigating multiple quality characteristics problems.
American Psychological Association (APA)
Liu, Chiun-Ming& Ji, Mei-Yu& Chuang, Wen-Chieh. 2013. Fuzzy TOPSIS for Multiresponse Quality Problems in Wafer Fabrication Processes. Advances in Fuzzy Systems،Vol. 2013, no. 2013, pp.1-6.
https://search.emarefa.net/detail/BIM-476286
Modern Language Association (MLA)
Liu, Chiun-Ming…[et al.]. Fuzzy TOPSIS for Multiresponse Quality Problems in Wafer Fabrication Processes. Advances in Fuzzy Systems No. 2013 (2013), pp.1-6.
https://search.emarefa.net/detail/BIM-476286
American Medical Association (AMA)
Liu, Chiun-Ming& Ji, Mei-Yu& Chuang, Wen-Chieh. Fuzzy TOPSIS for Multiresponse Quality Problems in Wafer Fabrication Processes. Advances in Fuzzy Systems. 2013. Vol. 2013, no. 2013, pp.1-6.
https://search.emarefa.net/detail/BIM-476286
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-476286