Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via
Joint Authors
Kaushik, Brajesh Kumar
Majumder, Manoj Kumar
Manhas, Sanjeev Kumar
Kumari, Archana
Source
Active and Passive Electronic Components
Issue
Vol. 2014, Issue 2014 (31 Dec. 2014), pp.1-7, 7 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2014-03-01
Country of Publication
Egypt
No. of Pages
7
Main Subjects
Abstract EN
Development of a reliable 3D integrated system is largely dependent on the choice of filler materials used in through-silicon vias (TSVs).
This research paper presents carbon nanotube (CNT) bundles as prospective filler materials for TSVs and provides an analysis of signal integrity for different single- (SWCNT), double- (DWCNT), and multi-walled CNT (MWCNT) bundle based TSVs.
Depending on the physical configuration of a pair of TSVs, an equivalent electrical model is employed to analyze the in-phase and out-phase delays.
It is observed that, using an MWCNT bundle (with number of shells = 10), the overall in-phase delays are reduced by 96.86%, 92.33%, 78.35%, and 32.72% compared to the bundled SWCNT, DWCNT, 4-shell MWCNT, and 8-shell MWCNT, respectively; similarly, the overall reduction in out-phase delay is 85.89%, 73.38%, 45.92%, and 12.56%, respectively.
American Psychological Association (APA)
Majumder, Manoj Kumar& Kumari, Archana& Kaushik, Brajesh Kumar& Manhas, Sanjeev Kumar. 2014. Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via. Active and Passive Electronic Components،Vol. 2014, no. 2014, pp.1-7.
https://search.emarefa.net/detail/BIM-478498
Modern Language Association (MLA)
Majumder, Manoj Kumar…[et al.]. Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via. Active and Passive Electronic Components No. 2014 (2014), pp.1-7.
https://search.emarefa.net/detail/BIM-478498
American Medical Association (AMA)
Majumder, Manoj Kumar& Kumari, Archana& Kaushik, Brajesh Kumar& Manhas, Sanjeev Kumar. Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via. Active and Passive Electronic Components. 2014. Vol. 2014, no. 2014, pp.1-7.
https://search.emarefa.net/detail/BIM-478498
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-478498