Structure and Thermal Stability of Copper Nitride Thin Films
Joint Authors
Pu, Jibin
Wang, Kaiyuan
Lu, Zhibin
Zhang, Guangan
Wu, Guizhi
Source
Indian Journal of Materials Science
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-6, 6 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-12-15
Country of Publication
Egypt
No. of Pages
6
Main Subjects
Abstract EN
Copper nitride (Cu3N) thin films were deposited on glass via DC reactive magnetron sputtering at various N2 flow rates and partial pressures with 150°C substrate temperature.
X-ray diffraction and scanning electron microscopy were used to characterize the microstructure and morphology.
The results show that the films are composed of Cu3N crystallites with anti-ReO3 structure.
The microstructure and morphology of the Cu3N film strongly depend on the N2 flow rate and partial pressure.
The cross-sectional micrograph of the film shows typical columnar, compact structure.
The thermal stabilities of the films were investigated using vacuum annealing under different temperature.
The results show that the introducing of argon in the sputtering process decreases the thermal stability of the films.
American Psychological Association (APA)
Zhang, Guangan& Lu, Zhibin& Pu, Jibin& Wu, Guizhi& Wang, Kaiyuan. 2013. Structure and Thermal Stability of Copper Nitride Thin Films. Indian Journal of Materials Science،Vol. 2013, no. 2013, pp.1-6.
https://search.emarefa.net/detail/BIM-493712
Modern Language Association (MLA)
Zhang, Guangan…[et al.]. Structure and Thermal Stability of Copper Nitride Thin Films. Indian Journal of Materials Science No. 2013 (2013), pp.1-6.
https://search.emarefa.net/detail/BIM-493712
American Medical Association (AMA)
Zhang, Guangan& Lu, Zhibin& Pu, Jibin& Wu, Guizhi& Wang, Kaiyuan. Structure and Thermal Stability of Copper Nitride Thin Films. Indian Journal of Materials Science. 2013. Vol. 2013, no. 2013, pp.1-6.
https://search.emarefa.net/detail/BIM-493712
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-493712