Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC
Joint Authors
Chakrabarty, Krishnendu
Shih, Chi-Jih
Hsu, Chih-Yao
Kuo, Chun-Yi
Rau, Jiann-Chyi
Li, James
Source
Active and Passive Electronic Components
Issue
Vol. 2012, Issue 2012 (31 Dec. 2012), pp.1-10, 10 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2012-11-28
Country of Publication
Egypt
No. of Pages
10
Main Subjects
Abstract EN
Testing is regarded as one of the most difficult challenges for three-dimensional integrated circuits (3D ICs).
In this paper, we want to optimize the cost of TAM (test access mechanism) and the test time for 3D IC.
We used both greedy and simulated annealing algorithms to solve this optimization problem.
We compare the results of two assumptions: soft-die mode and hard-die mode.
The former assumes that the DfT of dies cannot be changed, while the latter assumes that the DfT of dies can be adjusted.
The results show that thermal-aware cooptimization is essential to decide the optimal TAM and test schedule.
Blindly adding TAM cannot reduce the total test cost due to temperature constraints.
Another conclusion is that soft-die mode is more effective than hard-die mode to reduce the total test cost for 3D IC.
American Psychological Association (APA)
Shih, Chi-Jih& Hsu, Chih-Yao& Kuo, Chun-Yi& Li, James& Rau, Jiann-Chyi& Chakrabarty, Krishnendu. 2012. Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC. Active and Passive Electronic Components،Vol. 2012, no. 2012, pp.1-10.
https://search.emarefa.net/detail/BIM-496900
Modern Language Association (MLA)
Shih, Chi-Jih…[et al.]. Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC. Active and Passive Electronic Components No. 2012 (2012), pp.1-10.
https://search.emarefa.net/detail/BIM-496900
American Medical Association (AMA)
Shih, Chi-Jih& Hsu, Chih-Yao& Kuo, Chun-Yi& Li, James& Rau, Jiann-Chyi& Chakrabarty, Krishnendu. Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC. Active and Passive Electronic Components. 2012. Vol. 2012, no. 2012, pp.1-10.
https://search.emarefa.net/detail/BIM-496900
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-496900