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AlNGaN-Based MOS-HEMT Technology : Processing and Device Results
Joint Authors
MacFarlane, D.
Wasige, E.
Taking, S.
Source
Active and Passive Electronic Components
Issue
Vol. 2011, Issue 2011 (31 Dec. 2011), pp.1-7, 7 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2011-01-12
Country of Publication
Egypt
No. of Pages
7
Main Subjects
Abstract EN
Process development of AlN/GaN MOS-HEMTs is presented, along with issues and problems concerning the fabrication processes.
The developed technology uses thermally grown Al2O3 as a gate dielectric and surface passivation for devices.
Significant improvement in device performance was observed using the following techniques: (1) Ohmic contact optimisation using Al wet etch prior to Ohmic metal deposition and (2) mesa sidewall passivation.
DC and RF performance of the fabricated devices will be presented and discussed in this paper.
American Psychological Association (APA)
Taking, S.& MacFarlane, D.& Wasige, E.. 2011. AlNGaN-Based MOS-HEMT Technology : Processing and Device Results. Active and Passive Electronic Components،Vol. 2011, no. 2011, pp.1-7.
https://search.emarefa.net/detail/BIM-500825
Modern Language Association (MLA)
Taking, S.…[et al.]. AlNGaN-Based MOS-HEMT Technology : Processing and Device Results. Active and Passive Electronic Components No. 2011 (2011), pp.1-7.
https://search.emarefa.net/detail/BIM-500825
American Medical Association (AMA)
Taking, S.& MacFarlane, D.& Wasige, E.. AlNGaN-Based MOS-HEMT Technology : Processing and Device Results. Active and Passive Electronic Components. 2011. Vol. 2011, no. 2011, pp.1-7.
https://search.emarefa.net/detail/BIM-500825
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-500825