Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate
Joint Authors
Funawatashi, Yuichi
Ishizuka, Masaru
Koizumi, katsuhiro
Hatakeyama, Tomoyuki
Source
Active and Passive Electronic Components
Issue
Vol. 2011, Issue 2011 (31 Dec. 2011), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2011-11-22
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability.
High-density multichip packaging technology has been used in order to meet these requirements.
The higher the density scale is, the larger the power dissipation per unit area becomes.
Therefore, in the designing process, it has become very important to carry out the thermal analysis.
However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming.
This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool.
On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.
American Psychological Association (APA)
Ishizuka, Masaru& Hatakeyama, Tomoyuki& Funawatashi, Yuichi& Koizumi, katsuhiro. 2011. Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate. Active and Passive Electronic Components،Vol. 2011, no. 2011, pp.1-8.
https://search.emarefa.net/detail/BIM-500975
Modern Language Association (MLA)
Ishizuka, Masaru…[et al.]. Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate. Active and Passive Electronic Components No. 2011 (2011), pp.1-8.
https://search.emarefa.net/detail/BIM-500975
American Medical Association (AMA)
Ishizuka, Masaru& Hatakeyama, Tomoyuki& Funawatashi, Yuichi& Koizumi, katsuhiro. Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate. Active and Passive Electronic Components. 2011. Vol. 2011, no. 2011, pp.1-8.
https://search.emarefa.net/detail/BIM-500975
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-500975