Comparison of H2 and NH3 Treatments for Copper Interconnects
Joint Authors
Lin, Bing-Hong
Cheng, Yi-Lung
Wang, Ying-Lung
Leu, Jihperng
Chang, Yu-Min
Source
Advances in Materials Science and Engineering
Issue
Vol. 2013, Issue 2013 (31 Dec. 2013), pp.1-7, 7 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2013-12-19
Country of Publication
Egypt
No. of Pages
7
Main Subjects
Engineering Sciences and Information Technology
Abstract EN
The surface state, electrical, and reliability characteristics of copper (Cu) interconnects after ammonia (NH3) or hydrogen (H2) plasma treatment were investigated in this study.
The experimental results show that H2 plasma treatment has excellent Cu oxide removal efficiency, less impact on the formation of Cu hillocks, and less damage on low-dielectric constant (low-k) dielectrics in comparison to NH3 plasma treatment.
However, H2 plasma treatment results in a higher leakage current between the Cu lines and shorter electromigration (EM) failure time due to a weaker adhesion strength at the Cu film interface.
On the other hand, NH3 plasma treatment without the sufficient treatment time would lead to an increased probability of delamination at the Cu/barrier layer interface since the Cu oxide layer can not be completely removed.
As a result, extending NH3 plasma treatment time can efficiently reduce the adhesion failure and enlarge EM resistance as well.
American Psychological Association (APA)
Chang, Yu-Min& Leu, Jihperng& Lin, Bing-Hong& Wang, Ying-Lung& Cheng, Yi-Lung. 2013. Comparison of H2 and NH3 Treatments for Copper Interconnects. Advances in Materials Science and Engineering،Vol. 2013, no. 2013, pp.1-7.
https://search.emarefa.net/detail/BIM-501124
Modern Language Association (MLA)
Chang, Yu-Min…[et al.]. Comparison of H2 and NH3 Treatments for Copper Interconnects. Advances in Materials Science and Engineering No. 2013 (2013), pp.1-7.
https://search.emarefa.net/detail/BIM-501124
American Medical Association (AMA)
Chang, Yu-Min& Leu, Jihperng& Lin, Bing-Hong& Wang, Ying-Lung& Cheng, Yi-Lung. Comparison of H2 and NH3 Treatments for Copper Interconnects. Advances in Materials Science and Engineering. 2013. Vol. 2013, no. 2013, pp.1-7.
https://search.emarefa.net/detail/BIM-501124
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-501124