Multilayer, Stacked Spiral Copper Inductors on Silicon with Micro-Henry Inductance Using Single-Level Lithography
Joint Authors
Garcia, Ephrahim
Reissman, Timothy
Park, Joon-Sik
Source
Active and Passive Electronic Components
Issue
Vol. 2012, Issue 2012 (31 Dec. 2012), pp.1-8, 8 p.
Publisher
Hindawi Publishing Corporation
Publication Date
2012-04-03
Country of Publication
Egypt
No. of Pages
8
Main Subjects
Abstract EN
We present copper structures composed of multilayer, stacked inductors (MLSIs) with tens of micro-Henry inductance for use in low frequency (sub 100 MHz), power converter technology.
Unique to this work is the introduction of single-level lithography over the traditional two-level approach to create each inductor layer.
The result is a simplified fabrication process which results in a reduction in the number of lithography steps per inductor (metal) layer and a reduction in the necessary alignment precision.
Additionally, we show that this fabrication process yields strong adhesion amongst the layers, since even after a postprocess abrasion technique at the inner diameter of the inductors, no shearing occurs and connectivity is preserved.
In total, three separate structures were fabricated using the single-level lithography approach, each with a three-layered, stacked inductor design but with varied geometries.
Measured values for each of the structures were extracted, and the following results were obtained: inductance values of 24.74, 17.25, and 24.74 μH, self-resonances of 9.87, 5.72, and 10.58 MHz, and peak quality factors of 2.26, 2.05, and 4.6, respectively.
These values are in good agreement with the lumped parameter model presented.
American Psychological Association (APA)
Reissman, Timothy& Park, Joon-Sik& Garcia, Ephrahim. 2012. Multilayer, Stacked Spiral Copper Inductors on Silicon with Micro-Henry Inductance Using Single-Level Lithography. Active and Passive Electronic Components،Vol. 2012, no. 2012, pp.1-8.
https://search.emarefa.net/detail/BIM-505039
Modern Language Association (MLA)
Reissman, Timothy…[et al.]. Multilayer, Stacked Spiral Copper Inductors on Silicon with Micro-Henry Inductance Using Single-Level Lithography. Active and Passive Electronic Components No. 2012 (2012), pp.1-8.
https://search.emarefa.net/detail/BIM-505039
American Medical Association (AMA)
Reissman, Timothy& Park, Joon-Sik& Garcia, Ephrahim. Multilayer, Stacked Spiral Copper Inductors on Silicon with Micro-Henry Inductance Using Single-Level Lithography. Active and Passive Electronic Components. 2012. Vol. 2012, no. 2012, pp.1-8.
https://search.emarefa.net/detail/BIM-505039
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references
Record ID
BIM-505039