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Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder
Author
Source
Arab Journal of Nuclear Sciences and Applications
Issue
Vol. 52, Issue 3 (31 Jul. 2019), pp.1-15, 15 p.
Publisher
The Egyptian Society of Nuclear Science and Applications
Publication Date
2019-07-31
Country of Publication
Egypt
No. of Pages
15
Main Subjects
Abstract EN
The effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder were investigated.
Results show that Zn-addition reduced the melting temperature of Sn-0.7Cu and enhanced the creep resistance due to the formation of Cu5Zn8 intermetallic compound (IMC) and reduction of Cu6Sn5 phase in β-Sn matrix.
Conversely, the Sb-addition showed a negative effect on both the creep resistance and melting temperature compared to the plain Sn-0.7 Cu and Sn-0.7 Cu-2.0 Zn alloys due to the formation of SnSb IMC particles and coarse Cu6Sn5 phase through the β-Sn rich phase.
The average stress exponents of 4.9-6.0 and activation energies of 50-60 KJ/mol were obtained for three solders; suggesting that the dislocation climb controlled by lattice diffusion is the dominant creep mechanism.
X-ray diffraction (XRD) analysis revealed that the lattice parameters (a), (c), the axial rate (c/a) and the peak height intensities (hkl) of some crystallographic planes are changed with alloying additions and the crystallite size is decreased.
American Psychological Association (APA)
Yasin, A. M.. 2019. Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder. Arab Journal of Nuclear Sciences and Applications،Vol. 52, no. 3, pp.1-15.
https://search.emarefa.net/detail/BIM-891734
Modern Language Association (MLA)
Yasin, A. M.. Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder. Arab Journal of Nuclear Sciences and Applications Vol. 52, no. 3 (Jul. 2019), pp.1-15.
https://search.emarefa.net/detail/BIM-891734
American Medical Association (AMA)
Yasin, A. M.. Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder. Arab Journal of Nuclear Sciences and Applications. 2019. Vol. 52, no. 3, pp.1-15.
https://search.emarefa.net/detail/BIM-891734
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references : p. 14-15
Record ID
BIM-891734