Microstructure, creep deformation behavior and reliability of Sn-6.5wt % Zn-0.3 wt % Cu lead free solder after Bi additions
Joint Authors
Source
Arab Journal of Nuclear Sciences and Applications
Issue
Vol. 52, Issue 2 (30 Apr. 2019), pp.103-111, 9 p.
Publisher
The Egyptian Society of Nuclear Science and Applications
Publication Date
2019-04-30
Country of Publication
Egypt
No. of Pages
9
Main Subjects
Abstract EN
Creep characteristics of Sn-6.5 Zn-0.3 Cu plain solder was studied and compared with Sn-6.5 Zn-0.3 Cu-1 Bi and Sn-6.5 Zn-0.3 Cu-3 Bi solder alloys.
The results show that 3Bi-containing alloy solder has the higher creep resistance (~80 times) than the other two solders at the same stress level and testing temperatures.
The higher creep resistance was attributed to the solid solution and precipitations strengthening effects of Bi atoms.
The precipitation of Bi atoms or particles can significantly refine the microstructure, blocks the movement of dislocations and increases the creep resistance of Bi-containing solders.
Moreover, the creep life time of plain SZC plain solder alloy was extremely enlarged (~23.7 times) with the addition of 3 wt.
% Bi, which could result in improving the reliability of Bi-containing solders.
Additionally, the minimum creep strain rate in the steady state flow is developed during secondary creep and Garofalo model was created from the experimental data to predict the creep deformation mechanism.
Based on the obtained stress exponents and activation energies, it is proposed that the dominant deformation mechanism is dislocation climb over the whole temperature range investigated.
American Psychological Association (APA)
al-Khawas, E. H.& Fadil, M. M.. 2019. Microstructure, creep deformation behavior and reliability of Sn-6.5wt % Zn-0.3 wt % Cu lead free solder after Bi additions. Arab Journal of Nuclear Sciences and Applications،Vol. 52, no. 2, pp.103-111.
https://search.emarefa.net/detail/BIM-892208
Modern Language Association (MLA)
al-Khawas, E. H.& Fadil, M. M.. Microstructure, creep deformation behavior and reliability of Sn-6.5wt % Zn-0.3 wt % Cu lead free solder after Bi additions. Arab Journal of Nuclear Sciences and Applications Vol. 52, no. 2 (Apr. 2019), pp.103-111.
https://search.emarefa.net/detail/BIM-892208
American Medical Association (AMA)
al-Khawas, E. H.& Fadil, M. M.. Microstructure, creep deformation behavior and reliability of Sn-6.5wt % Zn-0.3 wt % Cu lead free solder after Bi additions. Arab Journal of Nuclear Sciences and Applications. 2019. Vol. 52, no. 2, pp.103-111.
https://search.emarefa.net/detail/BIM-892208
Data Type
Journal Articles
Language
English
Notes
Includes bibliographical references : p. 111
Record ID
BIM-892208